Monday, 17 February 2014

Third meeting of the Working Group on Enhanced Cooperation (WGEC) of the Commission on Science and Technology for Development



Key Issues

WGECThe sixty-seventh session of the General Assembly, held on 21 December 2012, adopted resolution 67/195 which invited the Chair of the CSTD to establish the Working Group on Enhanced Cooperation.
In view of this request, on 22 March 2013, the Chair of the CSTD announced the establishment of the Working Group with the following composition: 22 Member States (four per regional group, plus the two that have hosted the World Summit on the Information Society); five representatives from the private sector; five representatives from civil society; five representatives from the technical and academic communities; and five representatives from intergovernmental and international organizations.
 
This meeting is the third in a series of meetings intended for an exchange of views among stakeholders and to report the outcomes to the CSTD at its seventeenth session in 2014.
Participation and Registration
For all WGEC member State attendees who have a badge to enter the Palais des Nations, there is no need for registration at the gates to attend the meeting on 24-28 February 2014.
For all member State observers, if you have a badge to enter the Palais des Nations, there is no need for registration at the gates to attend the meeting on 24-28 February 2014. If you have delegates from the capitals who need badges, kindly see the process below.
For all other WGEC members who do not have badges that allow them entry into the Palais des Nations, we have made all necessary arrangements for badges to be issued at the Pregny Gate.
If you require a badge to enter the Palais, please complete the Conference Registration Form and submit it to wgec@unctad.orgby Thursday evening, 20 February, at the latest, if you wish that your badges are prepared in advance for collection at Pregny gate any time after 20 February. Please note that you need to present the original registration form and your Personal Identification to the Pregny Gate when you collect your badges.
If you do not submit this form by Thursday, 20 February, we request you to fill in and bring the registration form with you to the Pregny Gate. We kindly request you to arrive sufficiently early on 24 February (if possible, between 8:30-9:00) to Pregny Gate with your invitation letter and personal ID so that the badge process can be completed in time.
For all other observers, the first twenty-five registrations received by the Secretariat on a first-come, first-served basis will be notified to the Pregny Gate. The same procedure as specified above for all WGEC members who need badges applies to observers as well.
Participation via WebEx
For those unable to attend in person, remote participation to the meeting will be available through WebEx. If you would like to receive information about this mechanism for participation, please send an email to wgec@unctad.org
Sincerely yours,
Peter Major
Chair of the WGEC
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Intel turns Arduino board into a cloud-printer



Arduino Intel Galileo board
Arduino Intel Galileo board
Intel’s Galileo Arduino certified development board has the performance to be a Linux server and even a cloud terminal.
The development board, which is now available from Mouser Electronics, is built around Intel’s latest Quark X1000, a Pentium-class system-on-chip (SoC).
It is the first in a new family of Intel’s Arduino-certified boards and is hardware and software compatible with most Arduino shields designed for the Uno R3.
The Intel Galileo has several PC industry standard I/O ports and features that expand its capabilities beyond the Arduino ecosystem. A mini-PCI Express slot, 100Mbit Ethernet port, microSD slot, RS-232 serial port, USB Host port, USB Client Port, and 8 MByte NOR flash memory are also available on the board.
Galileo uses the Arduino Integrated Development Environment (IDE) interface to create programs for the Galileo called “sketches.” To run a sketch on the board, first connect a power supply, then connect Galileo’s USB Client port to a PC, and then upload the sketch from the IDE interface.
It is expected to used in Linux servers, USB host and cloud printers.
Mouser Electronics will be at Embedded World in Germany from February 25-27, 2014 and will be giving away over $20,000 in development tools, including the Intel Galileo.
- See more at: http://www.electronicsweekly.com/news/general/intel-turns-arduino-board-cloud-printer-2014-02/#sthash.qTYgfYQd.dpuf
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ST produces ultra-low power FD-SOI DSP

CEA-Leti and STMicroelectronics have made an ultra-wide-voltage range (UWVR) digital signal processor (DSP), based on 28nm ultra-thin body buried-oxide (UTBB) FD-SOI technology.
The 32-bit VLIW DSP embeds Fmax tracking and operates at 460MHz at 397mV and 2.6GHz at 1.3V.
The device, produced by ST in their 28nm UTBB fully depleted SOI process technology, allows body-bias-voltage scaling from 0V to +2V, decreases minimum circuit operating voltage, and supports clock-frequency operation of 460MHz at 400mV.
The demonstrator achieves UWVR, greater energy efficiency, and unprecedented levels of efficiency in voltage and frequency using a combination of design techniques.
ST and Leti developed and optimized standard cells libraries over the 0.275V-to-1.2V range: they offer ideal implementation results by virtue of non-overlapping power-performance characteristics. Among the optimized cells, fast pulse-triggered flip-flops are designed for variability tolerance at low voltage.
Additionally, on-chip timing-margin monitors dynamically adjust the clock frequency to a few per cent of the maximum operating frequency, independent of supply-voltage value, body-bias-voltage value, temperature, and process technology. As a result, even at 0.4V, the DSP exhibits 10x state-of-the-art operating frequency.
“UTBB FD-SOI technology is ST’s faster, cooler, simpler solution,” says ST evp Philippe Magarshack “it delivers significant improvements in performance and power savings while minimizing adjustments to existing design and manufacturing methodologies. This demonstration DSP shows that FD-SOI is blazing the trail for better portable and battery-powered products, using more efficient semiconductor chips, all the way down to the 10nm node.”
- See more at: http://www.electronicsweekly.com/news/business/st-produces-ultra-low-power-fd-soi-dsp-2014-02/#sthash.hlQmCn5T.dpuf
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Silicone-free cable is barrier-sealed for cars



huber+suhnerHuber + Suhner has introduced a silicone-free anti-capillary cable to meet the increasing demand for barrier sealed copper cables across the automotive industry.
The anti-capillary characteristics of the cable stops liquids in the vehicle, such as oil and water, being conveyed through the cable and damaging the electronics and sensors at the connected end.
Inside the cable conductor, a grease-like filling material prevents the capillary effect in the core.
This filling material is silicone free and so not affected by transmission fluid.
The cable also features an electron-beam cross-linked insulating material making it particularly resistant to high and low temperatures, ozone, weathering and has excellent abrasion resistance.
Designated Radox, the anti-capillary cable is available with tinned or plain copper wires with diameters from 0.5 to 1.5 mm2.
It can be crimped or ultrasonically welded to connect it to the connector.
- See more at: http://www.electronicsweekly.com/news/products/connectors/silicone-free-cable-barrier-sealed-cars-2014-02/#sthash.YimFXBwU.dpuf
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Intel squeezes x86 into SD Card



Intel Edison x86 SD CardIntel has announced an x86 embedded processing development board in an SD Card
Called Edison, the “board features a low-power 22nm 400MHz Intel Quark processor with two cores, integrated Wi-Fi and Bluetooth. It can be designed to work with most any device – not just computers, phones, or tablets, but chairs, coffeemakers, and even coffee cups”, said Intel, going on to it will be available in the summer.
Two cores?
“The product features a processor and microcontroller core. The programmable microcontroller helps manage I/Os and other baseline functions, while the x86-compatible processor core brings Linux support and enables multiple operating systems to run high-level user applications,” said Intel. “The compute package brings connectivity with Wi-Fi and Bluetooth LE, and has LPDDR2 and NAND flash storage as well as I/O capabilities.”
To help convert prototypes into products, Autodesk, said Intel, is adding Edison mechanical and electrical libraries to 123D Circuits, part of the Autodesk 123D suite.
“123D is a suite of tools to make designs, 3D printing and technology projects easy,” said Intel.
Little further information has been revealed about the board, or its processor.
Quark processors execute x86 instructions and are even more stripped down than the firm’s Atom series.
Embedded Quark
So far, only one Quark is available, the single-core single-thread X1000, described by Intel as a 32nm device and: “32bit Intel Pentium instruction set architecture [ISA]-compatible”.
X1000, Intel's existing Quark
X1000, Intel’s existing Quark
Aimed at embedded processing, X1000 is an SoC with a variety of peripherals – but no video capability.
It runs at 400MHz and has 16kbyte L1 cache plus 512kbyte of ECC-protected SRAM on the die.
The DDR3 800MTs memory interface has ECC, using only standard x8 DDR3 devices, and internally there is AMBA bus fabric, as well as a legacy bridge interface to PC compatible features.
All SoC clocks can be generated from a single crystal oscillator, and all requited supply rails from a “single COTS [commercial off-the-shelf] voltage regulator”, said Intel.
For security, the SoC features an on-die Boot ROM that is used to establish hardware-based trust. “The immutable code located within the boot ROM is used to initiate an iterative firmware authentication process ensuring only trusted code is executed when taking the platform out of reset,” said the firm.
Two of Intel’s acquisitions feature in the software: Wind River and McAfee.
Intel Quark X1000 software
Intel Quark X1000 software
The chip is supported by the Wind River Intelligent Device Platform (IDP), which is the operating system and middleware software stack that binds together connectivity, security, and management.
The software stack includes: UEFI EDK II open source firmware. GRUB open source boot-loader, Wind River Linux with IDP 2.0, Wind River VxWorks, and McAfee Embedded Control
Even without video, design power is 1.9-2.2W, suggesting operation from the mains, or day-use from a rechargeable battery.
The package is 15x15mm and, currently, only 0-70°C chips are available, although a -40 to 85°C version is planned, said Intel.
Intel Galileo
Intel Galileo
X1000 is used in the Intel Galileo which is “the first in a family of Arduino-compatible development boards based on Intel Architecture”,” said the firm.
Arduino-compatible in this case means it can directly accept Arduino expansion boards – also known as ‘shields’.
“It is the first board based on Intel architecture designed to be hardware and software pin-compatible with shields designed for the Arduino Uno R3,” said Intel. “The Galileo board is also software-compatible with the Arduino software development environment.”
Interfaces on 100x70mm Galileo include: 10/100Mbit Ethernet (RJ45), USB 2.0 Client port, USB 2.0 Host port, RS-232 UART port, 3.5mm jack, and Mini PCI Express (mPCIe) slot with USB2.0 Host support. 8Mbyte of NOR flash is standard. There is also a 10pin JTAG debug header and a reset button.
This is not a Raspberry Pi, BeagleBone Black, or RIoTboard competitor, because there is no video interface.
- See more at: http://www.electronicsweekly.com/news/design/embedded-systems/intel-x86-eval-board-sd-card-2014-02/#sthash.kvGM7jOP.dpuf
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Cambridge design self-organising mobile network deployed in China



CCS networkCambridge Communication Systems has developed a self-organising small cell microwave backhaul system for mobile networks which has been deployed with China Mobile.
The small cell network is one of China Mobile’s first outdoor deployments of 4G LTE-TDD small cells.
China is the world’s largest mobile market with an estimated 1.2 billion users.
According to recently released research by Dell’Oro, the global mobile backhaul equipment market is predicted to be worth $8bn by 2018 (January 2014).
According to CCS, the self-organising backhaul nodes were “deployed by local lighting contractors in only 15 minutes per site, without training or the need to perform complicated frequency planning or alignment, delivering immediate and optimal 4G coverage to China Mobile subscribers”.
A single unit connects to other units to create a multipoint-to-multipoint network that self-organises into the most optimal topology, without the requirement to post-optimise. The locations consist of a single CCS node together with a single or dual small cell, forming a 4G/LTE Macro and small cell HetNet (heterogeneous network).
The network is now carrying live 4G traffic and the network dynamically reconfigures and scales to connect further small cells in surrounding areas.
China Mobile currently has around 763 million subscribers and launched its TD-LTE network in December 2013. China Mobile expects to construct its 4G networks in over 340 cities to reach a total of more than 500,000 TD-LTE base stations by the end of 2014.
“This is a highly significant deployment for CCS,” said CCS CEO Steve Greaves.
“Our self-organising, self-healing nodes are able to be very swiftly and flexibly deployed by relatively untrained contractors – without any upfront frequency planning or optimisation – saving both time and money while delivering the high levels of capacity, latency and redundancy demanded by China Mobile,” said Greaves.
CCS will be showcasing its solution at the upcoming Mobile World Congress 2014 in Barcelona (24 to 27 February, Fira Gran Via).
- See more at: http://www.electronicsweekly.com/news/general/cambridge-design-self-organising-mobile-network-deployed-china-2014-02/#sthash.JWLfDAii.dpuf
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HOT articles for February


4
By Judy Allen, Publishing Assistant.
These articles are HOT as recommended by the referees. And we’ve made them free to access for the next 4 weeks!
Dimerization of ethene in a fluidized bed reactor using Ni-based Supported Ionic Liquid Phase (SILP) catalystsFlorian T. U. Kohler, Konstantin Gärtner, Veit Hager, Marco Haumann, Michelle Sternberg, Xinjiao Wang, Normen Szesni, Karsten Meyer and Peter Wasserscheid
Catal. Sci. Technol., 2014, Advance Article
DOI: 10.1039/C3CY00905J
Graphical abstract

Kinetic Monte Carlo simulations of heterogeneously catalyzed oxidation reactionsFranziska Hess and Herbert Over
Catal. Sci. Technol., 2014, Advance Article
DOI: 10.1039/C3CY00833A
Graphical abstract



By Judy Allen, Publishing Assistant.
Homogeneous catalytic reduction of CO2 with hydrosilanesFrancisco J. Fernández-Alvarez, Abdullah M. Aitani and Luis A. Oro
Catal. Sci. Technol., 2014, Advance Article
DOI: 10.1039/C3CY00948C      
Graphical abstract

CO2 photoreduction with H2O vapor by porous MgO–TiO2 microspheres: effects of surface MgO dispersion and CO2adsorption–desorption dynamicsLianjun Liu, Cunyu Zhao, Daniel Pitts, Huilei Zhao and Ying Li
Catal. Sci. Technol., 2014, Advance Article
DOI: 10.1039/C3CY00807J    
Graphical abstract   

Chromium(III) amine-bis(phenolate) complexes as catalysts for copolymerization of cyclohexene oxide and CO2Hua Chen, Louise N. Dawe and Christopher M. Kozak
Catal. Sci. Technol., 2014, Advance Article
DOI: 10.1039/c3cy01002c
Graphical abstract

Self-regeneration of three-way catalyst rhodium supported on La-containing ZrO2 in an oxidative atmosphereHisaya Kawabata, Yuki Koda, Hirosuke Sumida, Masahiko Shigetsu, Akihide Takami and Kei Inumaru
Catal. Sci. Technol., 2014, Advance Article
DOI: 10.1039/C3CY00838J
Graphical abstract

Developing an efficient catalyst for controlled oxidation of small alkanes under ambient conditionsPenumaka Nagababu, Steve S.-F. Yu, Suman Maji, Ravirala Ramu and Sunney I. Chan
Catal. Sci. Technol., 2014, Advance Article
DOI: 10.1039/C3CY00884C
Graphical abstract

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http://www.smi-online.co.uk/energy/uk/conference/flng


Following the success for the inaugural FLNG conference SMi proudly presents their 2nd annual Floating LNG 2014 conference. This year’s conference aims to focus on current project updates and developments within the field, the LNG market dynamics and economics to determine what is driving the industry forward, technological innovations, case studies from leading infrastructure providers as well as cover project finance and risks associated with this dynamic industry.

Over the last two years, since Shell reach its final investment decision on project prelude the industry has seen a great shift in people’s perception towards FLNG, once thought of as a means to access stranded gas fields FLNG is becoming, in some eyes much more than that. SMi’s 2nd annual Floating LNG will look at exploring these developments and ultimately discus and answer some leading questions into the developments of this technology.
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